TEMPE, Ariz., Sept. 23, 2014 /PRNewswire/ -- Amtech Systems, Inc. (NASDAQ: ASYS), a global supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and sapphire and silicon wafers, today announced its solar subsidiary, Tempress Systems, has received field acceptance of its PECVD production tools from a leading Asian solar cell and panel manufacturer.
Mr. Fokko Pentinga, Chief Executive Officer of Amtech, commented, "We are very pleased with the progress we have made in developing and bringing to market a world class PECVD system. The acceptance we received demonstrates our capability and commitment to supply industry leaders with high value equipment and service. We are pleased to provide our advanced solar technology solutions to a leading solar cell and panel manufacturer respected for its global leadership and innovative products. We continue to focus on developing the technologies necessary to meet the growing global demand for high efficiency solar energy solutions. Through such advanced technologies we are expanding our customer base and geographic presence. We continue to see growing interest in the global marketplace for next generation solutions and a promising 2015 for Amtech."
About Amtech Systems, Inc.
Amtech Systems, Inc. manufactures capital equipment, including silicon wafer handling automation, thermal processing and ion implant equipment and related consumables used in fabricating solar cells, LED and semiconductor devices. Semiconductors, or semiconductor chips, are fabricated on silicon wafer substrates, sliced from ingots, and are part of the circuitry, or electronic components, of many products including solar cells, computers, telecommunications devices, automotive products, consumer goods, and industrial automation and control systems. The Company's wafer handling, thermal processing and consumable products currently address the diffusion, oxidation, and deposition steps used in the fabrication of solar cells, LEDs, semiconductors, MEMS and the polishing of newly sliced silicon wafers.