COF-capable TAB potting System

1. COF ( Chip On Film ) technology is mainly applied in cellular phone panel driver IC field . It is thinner and more flexible comparing with TAB tape . Except the Driver IC bonded on the film，the other passive component，such as resistor，capacitor，transistor for transforming voltage，also can be Mount on Film PAD . It can effectively reduce IC design complexity and size .

2. The film is fully flexible beside the component mounted area . And COF module can be assembled by auto-machine，so cost is relatively reduced . Comparing with COG ( Chip On Glass )，COF is more reliable (e.g. thermal shock test，steady state humidity test ) . The biggest difference between COF and TAB is the raw material structure .

3. COF is 2 layers structure ( PI，polyimide + copper foil )，but TAB Tape is 3 layers structure ( PI + Adhesive + Copper foil ) . And there is no device hole ( no flying lead ) on the film . The total thickness is thinner，and more flexible，the peeling strength is better，too . It is the next generation package substrate .

1. Ergonomically designed for user-friendly operation

2. The roller type method of tape feeding is adopted, able to feed the thinnest tapes. (From 25um)

3. The variation corresponding to various demands of customers is prepared. Ex. 4 heads potting machine which productive capability raised sharply 1 stage oven which oriented for COF

4. The CPU board has a data capacity double that of MS-1890 series

5. The application heads are programmed with 1um resolution to ensure more precise application.

6. Temperatures up to 200 degreeC resist

Target Devices
Tape width: 35[mm], 48[mm], 70[mm]

Appropriate tape
  35 [mm] wide, 35 [mm] super
  48 [mm] wide, 48 [mm] super
  70 mm wide

Thickness 0.025 to 0.125 [mm]

Material Polyimide Tape (Kapton, Upilex)

Application pitch
4 heads with equally spaced application 2～10[pf]

*1. When Alignment mark are situated within +/- 11 mm (X direction) and +/- 25 mm (Y direction) from Chip Center.
*2. Excludes the condition of resin curing.

Dimensions
X:1~5 x Y:5~30 [mm]
*At these dimensions, the chips will not be damaged while being fed over the reel [100 radius]

Chips
Thickness 0.2 ~ 1.0 [mm]
TAB Reel Max.620 [mm] in diameter
Reel (1[inch] hub, with ４[mm] key)
Spacer Reel Max.520 [mm] in diameter
(１[inch] hub, with ４[mm] key)