Products


ASAHI DIAMOND INDUSTRIAL CO., LTD.




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Dicing Blade


Applications

  • Wafer Saw

Features

  • High tensile strength stainless-steel core
  • High-precision and highly-flat cutting surface
  • Achieves a high cutting efficiency

Specification

  • Customization

Keyword

Dicing Blades, Wafer Saw, 硬刀,晶圓切割,硬刀,晶圆切割