High adhesion and hardness bond for temporary adhesion.

Application of Epoxy Bond:

‧ Semiconductor  Wafer Industry:

‧ Solar PV Wafer Industry:

‧ How to use Epoxy Bond:

Features & Advantages

Two componenet fype epoxy bonds for slicing ingots or blocks.

It is user-friendly because less toxic and cand be removed by hot water.

Mixing ratio is 1:1 or 2:1.

Many types such as quick cure type and strong adhering type are available for meeting your process.

Industry achievements

Widely used in semiconductor wafer factory & solar wafer factory & sapphire wafer factory & quartz crystal cutting factory

Photos of Epoxy Bond

U-Bond : New generation-low viscosity bond for PV wafer slicing process by wire-saw.

B-Bond : Developed for blnding slicing beam and metal jig plate.  Removed by heating at lower temp. range than the standard bond (U or Q).

Q-Bond : High quality bond for various diameter semiconducter ingot slicing.

W-Bond : For semiconductor ingot slicing.  High hardness and high adhesion type.

Note: The above is for application reference. We can evaluate products according to customer needs. Please contact us to communicate and decide the most suitable type.