Products


Contact with me

Lithography Stepper


Applications

 


Features

a. High resolution (1.5 um / 3 um)

b. Low cost of owner ship

•System Price
•Mask Cost
•Throughput
•Higher System Utilization
•Flexibility (Fast Changeover)
Adaptable to meet future needs.

c. Small Footprint

 


Specification

1. SYSTEM PERFORMANCE
    a. Resolution
        1.5 μm L/S (< ± 10% CD, Positive photo resist 1 μm thickness)
    b. Depth of Focus
        > 9 μm (Positive photo resist 1 μm thickness)
    c. Overlay
        |Mean| + 3σ < 0.5 μm
        On the condition that |Mean| correction should be done before test and 4 pts EGA
    d. Stitching-Accuracy
        Base system stitching: < 0.50 μm (98%)
    e. Throughput
        Base system throughput < 3000 sec per 20 plates (150sec per plate)
        (Excluding time for loading first glass from cassettes and unloading last glass to cassettes, and estimate 15sec of plate exchange time is included – any difference in plate exchange time can change throughput by that amount)
        Conditions:
        1. Substrate size: 680mm x 880mm
        2. Substrate thickness: One type among 0.5~1.1mm (Thickness tolerance 10%)
        3. Number of reticles: Six (5 reticle exchanges)
        4. Exposure time setting: 30mJ – Dose setting
        5. Number of substrates: 20 plates
        6. Stepping Travel: Customized based
        7. Number of Exposures: Customer Product layout based
        8. Alignment: 4 pts EGA alignment
        9. Alignment Time: < 11sec (4pts EGA from the TACT result)