• Anneal,
• Oxidation
• High temperature oxidation

• 200mm and 300mm integrated full automation.
• Tube- Independent, Furnace control
•  Lower COO
• Slip Free

BDF300 GENERAL SYSTEM CONFIGURATION

• Main system dimensions: 3.017m (height) x 3.222m (width) x 7.700m (length)
• Remote power unit dimensions:1.588m (height) x 0.900m (width) x 0.465m (depth)
• Operating voltage:480V, 3 phase, Delta, 60Hz
• UPS:1500VA for system back-up and shutdown only; BTI Supplied; Controls Only
• Language of warning and alarm labels:English Text and CE Symbols

BDF300 RELIABILITY AND MAINTENANCE

• Quarterly PM time: Automation Only; Inspection; Alignment
• Annual PM time:15 hours
• MTBF> 500 hours
• MTTR< 8 hours
• MTBA> 300 hours
• MTTA< 1 hour
• MTBC≥1 year
• Wafer breakage:<1 in 100,000