Features & Advantages
• High bonding strength => Adhesive strength evaluation according to different materials and processes
• High flatness => Meet the needs of high-precision grinding and polishing of wafers
• Easy to operate => select the most suitable product according to operating temperature, operating viscosity, temperature resistance, etc.
• Convenient cleaning => provide cleaning solutions according to customers’ needs without causing residual pollution
Industry achievements
• Sapphire wafer factory: small-sized copper polishing process (90% market share)
• LED wafer factory: back grinding thinning (100% market share)
• Quartz product processing plant: Wafer Dicing process (market share 70%)
• Other machining processes
Photoes of our variety solid wax:
