In scribing process by laser, coating Nanoshelter on wafer surface in advance enables the wafer to be protected from readheering od debris.

Others way :

• Before using the bond, coating Nanoshelter first, prevent the residual bond in wafer.
• Can reduce the problem of re-adhering of debris during laser or blade cutting process.

Features & Advantages

Block of re-adhering of debris
-By coating Nanoshelter, watersoluble coating adent, it blocks direct contact od transpired debris on to work-piece and prevent from re-adhering.

Watersolubility
-After the process, Nanoshelter can be cleaned by water with debris.

No need of baking
-After spin-coating, it can be dried by spinning itself.

Photos of Coating agents:

Packageing Type:

• Laser protection coating agent was package by 4L. Watersolubility
• Others protection coating agent of resin base, un-Watersolubility
• Almost product is customizer, if you can't find any product you want, please contact with us first.