Application of Dry Preventive Agent
DRYNON-C is water soluble dry preventive agent for an effective use in/after surface polishing process of Si wafer, glass and other various materials.it resolves wafer cleaning problem due to generation of stain and adhesion of dried abrasives after polishing. Thus, residual particles are reduced.

Applicable industries: front-end wafer semiconductor factory/recycled wafer factory

Applicable process: Wafer storage after grinding / cleaning process improvement / water wheel (transport storage)

Application examples

1.Coating

2.Water storage

How to use DRYNON-C

1. Dilute with DI water according to the appropriate ratio and stir well before use.
2. Soak polished wafers or workpieces in the diluted solution for 10~30 sec.
3. In case soaking is difficult, coat on the surface of workpiece equally with the diluted solution.
4. Take the workpiece out of the solution tank and shake off drips lightly.
5. It can be easily rinsed off with DI water after use, as it is water-soluble.

Features & Advantages

• Improved cleanability：Prevent adhesion of dried particles, and improves cleanability.
• Chelate effect：Catch ionized metals and prevent metal contamination.
• Prevention of natural oxide layer：Prevent generation of natural oxide layer on Si wafer after polishing process.

Industry achievements

Semiconductor wafer factory: grinding and polishing process

Note:New products are under continuous development. If you have other needs, please contact us to communicate and decide the most suitable type.