Contact with me
Probing Handler
Applications
-
PCP-series is a prober developed to make tests of a thin layered wafer, a diced wafer, and a peculiar shaped board in addition to a conventional wafer a reality.
-
It is designed to convey a conventional wafer, a film frame with a wafer or a peculiar shaped board automatically from the cassette, pre-align, fine-align, and probe.
Features
-
PCP-103SL/303N: For WLCSP and Strip form devices such as BGA-QFN etc.
Specification
-
PCP-303N: Film Frame Size:400mm(2-12-1) /300mm(2-8-1)※ Option
-
Foot prints:W1570mm*D1000mm/Weight:600kg
Keyword
Probing Handler,點測機,探針測試臺,WLCSP,無引線封測,After Dicing Prober,,点测机,探针测试台,晶圓切割後點測機,无引线封测,晶圆切割后点测机,