1. Completely wireless clamp meter with self-charging, no wiring required
2. Real-time power consumption monitoring with equipment anomaly alerts
3. Quick installation without shutdown, avoiding production downtime, with low implementation cost

1. Seismic resistance up to magnitude 7, supporting equipment weights up to 4 tons
2. Easy installation and reconfiguration, washable and reusable
3. Floor-friendly alternative to traditional rivet fixing, suitable for cleanroom environments

1. Smallest footprint in the industry, supporting multiple communication interfaces
2. Outstanding communication performance even in environments with electromagnetic noise and metal interference
3. Supports semiconductor industry SEMI standards (SECS-GEM)

1. Energy savings of 15% to 65%
2. Improves air conditioning system efficiency
3. Reduces operating costs

1. With over a century of history, specializing in heat treatment oven technology
2. Offering a full range from benchtop and cabinet ovens to ultra-large ovens, meeting the needs of various industries

1. Widely used in various packages such as glass, ceramics, and compound materials
2. Customizable bonding agents to suit both high rigidity and high cutting force requirements
3. Available in three types: resin blades, metal blades, and electroformed blades

1. Suitable for wafer dicing blades
2. Improves cutting efficiency and reduces time costs
3. Reduces coolant consumption

1. Provides versatile atmospheric and CVD process chambers, suitable for any type of silicon wafer
2. Capable of batch processing 25–200 wafers per tube
3. Fully automated vertical and horizontal furnaces for high-temperature oxidation and LPCVD applications

1. No metal-to-metal friction inside the vacuum
2. Streamlined design to reduce cost and space requirements
3. Standard design supports 1 million cycles, featuring high durability and low maintenance

1. High-speed color/monochrome inspection for wafer defects
2. Optional ring illumination and transmitted illumination, each compatible with color filter sets
3. Enhanced defect detection capability & productivity

1. Capable of detecting wafer surface particles or defects
2. Utilizes a violet-LD surface analyzer to effectively reduce operating costs
3. High performance, high quality, and high measurement speed with easy operation

1. High-precision bump height and coplanarity measurement with 3σ ≤ 1.0 μm
2. Inspection time per sample is less than 2 seconds. With proprietary processing algorithms and dedicated hardware, tens of thousands of high-density bumps can be measured in an extremely short time
3. Capable of measuring circular bumps as small as φ30 μm

1. Capable of probing standard wafers, thinned wafers, diced wafers, and substrates with special shapes
2. Automatically transported from carriers via a controlled transfer system for subsequent inspection
3. Supports multi-zone measurement

1. Wide range of applications, including exposure offset inspection, defect inspection, and CoWoS HBM offset inspection
2. Top-side alignment and back-side alignment processes
3. 3D inspection technologies such as white light interferometry, confocal microscopy, and AFM

1. Simple structure with low failure rate
2. Unique piping distribution design for easy resistivity control and excellent stability
3. Long service life of the CO₂ supply module

1. High Accuracy: Capable of detecting trace additives and metal ions (Au, Cu, Pd, Si, Ni, etc.) down to below 100 ppm
2. Versatile Analysis: Suitable for mixed chemical solutions, capable of analyzing 6 to 8 components simultaneously
3. Rapid Detection: No consumables required, analysis results in as fast as 10 seconds

1. Non-contact Detection: No direct contact with chemical solutions, preventing contamination and loss
2. High Temperature Tolerance: Capable of analyzing chemical solutions up to 160°C
3. Flexible Usage: Wide concentration range supported,  no hardware modification required for concentration changes

1. Chemical supply system, wet bench and single-wafer cleaning machine
2. Professional facility engineering services

1. Real-time monitoring and measurement of specific parameters such as vibration, temperature, and humidity
2. Equipped with wireless transmission, allowing alert thresholds to be set and notifications to be sent
3. AIoT edge computing device with a built-in data compression algorithm (Decay Rate)

1. High-strength temporary bonding wax, with customizable strength requirements based on different materials and processes
2. Easy to operate, with product options available based on operating temperature, working viscosity, and heat resistance
3. Easy to clean, with tailored cleaning solutions available to meet customer needs, leaving no residual contamination

1. Water-soluble protective solution that prevents laser-cutting byproducts from directly contacting or reattaching to the wafer
2. Applicable to industries such as fan-out packaging, CIS sensor packaging, DDIC chip COG/COF packaging, and memory chip bumping packaging
3. Excellent protection, easy to clean, and stable performance

1. Ion source low-temperature etching
2. Ion source physical vapor deposition (PVD)
3. Dry etching

1. Software developer and system integrator for front-end and back-end of Industrial IoT
2. Security industry
3. Intelligent transportation systems (ITS), Industry 4.0 applications, Smart City, and material handling/warehousing

1. The world’s leading manufacturer of Smart Cut technology splitting equipment for SOI wafers
2. Provides stand-alone systems or fully automated Smart Cut wafer splitting equipment integrated with horizontal/vertical furnaces

1. All-round spray pattern improves cleaning under low-distance components and eliminates shadow effects
2. Adopts mixed spray technology
3. Provides a variety of integrated design functions to save chemicals and electricity and reduce consumption

1. With strict closed-loop process control, it is designed for today's high-throughput assembly environment
2. It significantly reduces the thermal difference of the product and uses less energy
3. It reduces maintenance requirements and lowers the cost of ownership through cutting-edge flux processing technology

1. ± 35μ 3 Sigma dispensing accuracy at full speed
2. Innovative board grading options that expand the dispensing area in the X direction by 1-3 times, with a maximum processing size of 900 mm
3. Patented tilt and rotation technology that reduces KOZ and improves capillary flow of bottom fill

1. An optimized system processing speed can increase the margin of key printing parameters
2. Wet printing accuracy improved by 25%: built-in ±8 micron alignment accuracy and ±15 micron printing repeatability (≥2 Cpk @ 6σ)
3. No printing deviation: high-precision pressure sensor can eliminate pressure changes before and after, keeping the pressure of the entire surface constant

1. Ensure the wafer surface is clean and dust-free, which helps to ensure process stability and product quality
2. Anti-static ability helps to protect the safety of wafers and processes

1. High-power electronic component packaging material, using advanced nano silver technology
2. Can be sintered and applied directly on copper plates without gold or silver plating
3. Provide dispensing, screen printing, pressureless, and pressure sintering

1. Excellent BLT control, capable of constructing high-reliability and ultra-fine pitch 3D packaging structures
2. High conductivity, high heat dissipation, and good electromigration resistance
3. Provide solder alloy-coated copper core balls and gold-plated copper core balls

1. Uniform sphericity and small diameter tolerance
2. Excellent oxidation resistance, high solderability, and high reliability
3. Available in 0.05mm - 1.0mm and customized sizes

1. Can choose cavity configuration according to needs, highly customized, up to a maximum of 6 cavities
2. Optional thin film processing architecture, ICP, degas, or long throw architecture
3. Reactive sputtering can be optionally combined with in-situ pasting modules
4. Highly automated with SECS/GEM

1. Coating using high-vacuum physical methods
2. Carbon film has high purity, high density, and few impurities
3. Provide a good stair step coverage effect
4. Special design to reduce particles

1. Alignment accuracy less than ± 50um
2. Specialized bubble-free construction method
3. Can bond 150/150mm with the same size
4. Suitable for applications in GaAs, GaN, SiC, LED, 3DIC, and other fields

1. After developing with photoresist or PI, desicum can be used to remove the residue of PR or PI
2. Removal of Laser Release Layer
3. Dry etching is applicable to ABF
4. Suitable for removing the damaged layer using plasma polishing after grinding SiC chips

1. Correspond to wafers of various sizes and substrates of different materials
2. Temperature range: -200 ℃~1200 ℃
3. The number of sensors can be customized according to demand
4. High specification accuracy: sensor to sensor ± 0.5°

1. WET technology can reduce water consumption by up to 90%, thanks to its point-of-use process and ultra-high water purity
2. WET’s simplified process (eliminating the need for reverse osmosis and filtration) can reduce energy consumption per liter of water by up to 50%
3. Reduces water usage and enables reuse: Wet can serve as a point-of-use recovery system, returning water directly to the production process or discharging it to the wastewater treatment plant

1. Reduced KOZ (Keep-Out Zone)
2. Simplified process (no need for flux removal or underfill)
3. Excellent solder joint reliability

1. Using formic acid reflow technology, eliminating the need for flux coating and cleaning
2. Simple process, low cost, and effective in increasing productivity
3. Applicable to 6-inch, 8-inch, and 12-inch standard as well as warped wafers

1. Minimal heat-affected zone with high-precision microfabrication, suppressing microcracks and supporting processing down to φ0.1 mm
2. Arbitrary shapes with straight cutting, not limited by focal depth, ensuring no edge inclination
3. Compatible with various materials, enabling the processing of both semiconductors and high-hardness materials

1. Design and Manufacturing of Anti-Vibration Steel Structures and Vibration Isolation Engineering
2. Rigid Vibration-Isolated Equipment Base

1. PI/PBI curing furnace tubes for advanced semiconductor packaging
2. Wafer baking furnace tubes for simulating harsh environments

1. Process-oriented: models available for diffusion, CVD, dry etching, PVD, and other processes
2. Predictive system for pump failures
3. Ultra-energy efficient with exceptionally long mean time between failures (MTBF)

1. Highly integrated design, reducing space requirements
2. Applied in advanced 7nm/5nm/3nm/2nm diffusion, chemical vapor deposition (CVD), and dry etching equipment
3. Providing customized products and services for equipment manufacturers

1. Applied in advanced 7nm/5nm/3nm/2nm diffusion, chemical vapor deposition (CVD), and dry etching equipment
2. Providing ultra-precise gas mass flow control for the semiconductor industry (AFC/AFCe: setpoint error within 1%)

TIM1 thermal paste and various materials for advanced packaging of AI and HPC chips

1. 2D and 3D measurement of roughness, warpage, and shape
2. 2D and 3D surface defect measurement
3. Thin film stress measurement