Smart Clamp Meter
3Egreen
Smart Clamp Meter
3Egreen
  1. Completely wireless clamp meter with self-charging, no wiring required
  2. Real-time power consumption monitoring with equipment anomaly alerts
  3. Quick installation without shutdown, avoiding production downtime, with low implementation cost
AccuSave AI Chiller Energy Saving System
ECOFIRST
AccuSave AI Chiller Energy Saving System
ECOFIRST
  1. Energy savings of 15% to 65%
  2. Improves air conditioning system efficiency
  3. Reduces operating costs
Oven
Despatch
Oven
Despatch
  1. With over a century of history, specializing in heat treatment oven technology
  2. Offering a full range from benchtop and cabinet ovens to ultra-large ovens, meeting the needs of various industries
Real-time Chemical Concentration Analyzer (Drug withdrawal cycle type)
Mega Crystal
Real-time Chemical Concentration Analyzer (Drug withdrawal cycle type)
Mega Crystal
  1. High Accuracy: Capable of detecting trace additives and metal ions (Au, Cu, Pd, Si, Ni, etc.) down to below 100 ppm
  2. Versatile Analysis: Suitable for mixed chemical solutions, capable of analyzing 6 to 8 components simultaneously
  3. Rapid Detection: No consumables required, analysis results in as fast as 10 seconds
Real-time Chemical Concentration Analyzer (Clip type)
Mega Crystal
Real-time Chemical Concentration Analyzer (Clip type)
Mega Crystal
  1. Non-contact Detection: No direct contact with chemical solutions, preventing contamination and loss
  2. High Temperature Tolerance: Capable of analyzing chemical solutions up to 160°C
  3. Flexible Usage: Wide concentration range supported,  no hardware modification required for concentration changes
Equipment Performance and Failure Prevention Quick Screening Kit
SmartTag
Equipment Performance and Failure Prevention Quick Screening Kit
SmartTag
  1. Real-time monitoring and measurement of specific parameters such as vibration, temperature, and humidity
  2. Equipped with wireless transmission, allowing alert thresholds to be set and notifications to be sent
  3. AIoT edge computing device with a built-in data compression algorithm (Decay Rate)
Factory Vision Automation System
TDV
Factory Vision Automation System
TDV
  1. Software developer and system integrator for front-end and back-end of Industrial IoT
  2. Security industry
  3. Intelligent transportation systems (ITS), Industry 4.0 applications, Smart City, and material handling/warehousing
SOI Wafer Smart Cut™ Technology Splitting Equipment
R2D Automation
SOI Wafer Smart Cut™ Technology Splitting Equipment
R2D Automation
  1. The world’s leading manufacturer of Smart Cut technology splitting equipment for SOI wafers
  2. Provides stand-alone systems or fully automated Smart Cut wafer splitting equipment integrated with horizontal/vertical furnaces
Soda Lime Glass
NSG
Soda Lime Glass
NSG
  1. Applied in TN-LCD, STN-LCD products
  2. Main glass material used in touch panels
  3. Can be used as the main material of the protective layer glass on the upper layer of the touch panel
  4. Ultra-thin alkali glass
  5. Global flat glass market share is 50%
  6. Glass thickness: 0.28t~1.1t
  7. Maximum motherboard glass size: G6
Glanova
NSG
Glanova
NSG
  1. Glanova for smartphone
  2. Chemically strengthened thin glass for Automotive applications
  3. High and sufficient strength
  4. Easy heat 3D forming by its low softening point
  5. Lower cost than other competitive materials
Panel-Level Automatic Optical Inspection Tool (AOIL)
3i system
Panel-Level Automatic Optical Inspection Tool (AOIL)
3i system
  1. High-speed focusing microscope system with transmission and reflection modes
  2. Efficient image processing and intelligent algorithms, magnification up to 100 times
  3. Full-area measurement, no non-inspection area
Panel-Level Automatic Optical Inspection Tool (AOIH)
3i system
Panel-Level Automatic Optical Inspection Tool (AOIH)
3i system
  1. Applicable to defect detection of various panels such as array, color film, touch screen and organic light-emitting diode
  2. Maximum measurement accuracy is 1.0 micron
  3. Maximum detection speed can be customized
CDOL
3i system
CDOL
3i system
  1. High-speed focusing microscope system with transmission and reflection modes
  2. Efficient image processing and intelligent algorithms, magnification up to 100 times
  3. Full-area measurement, no non-inspection area
Electrovert Cleaner
ITW EAE
Electrovert Cleaner
ITW EAE
  1. All-round spray pattern improves cleaning under low-distance components and eliminates shadow effects
  2. Adopts mixed spray technology
  3. Provides a variety of integrated design functions to save chemicals and electricity and reduce consumption
Centurion™ Reflow
ITW EAE
Centurion™ Reflow
ITW EAE
  1. With strict closed-loop process control, it is designed for today's high-throughput assembly environment
  2. It significantly reduces the thermal difference of the product and uses less energy
  3. It reduces maintenance requirements and lowers the cost of ownership through cutting-edge flux processing technology
Prodigy™ Dispenser
ITW EAE
Prodigy™ Dispenser
ITW EAE
  1. ± 35μ 3 Sigma dispensing accuracy at full speed
  2. Innovative board grading options that expand the dispensing area in the X direction by 1-3 times, with a maximum processing size of 900 mm
  3. Patented tilt and rotation technology that reduces KOZ and improves capillary flow of bottom fill
Edison™ Printer
ITW EAE
Edison™ Printer
ITW EAE
  1. An optimized system processing speed can increase the margin of key printing parameters
  2. Wet printing accuracy improved by 25%: built-in ±8 micron alignment accuracy and ±15 micron printing repeatability (≥2 Cpk @ 6σ)
  3. No printing deviation: high-precision pressure sensor can eliminate pressure changes before and after, keeping the pressure of the entire surface constant
Cleanroom Wipers
Texwipe
Cleanroom Wipers
Texwipe
  1. Ensure the wafer surface is clean and dust-free, which helps to ensure process stability and product quality
  2. Anti-static ability helps to protect the safety of wafers and processes
Sintered Silver Paste
JuFeng
Sintered Silver Paste
JuFeng
  1. High-power electronic component packaging material, using advanced nano silver technology
  2. Can be sintered and applied directly on copper plates without gold or silver plating
  3. Provide dispensing, screen printing, pressureless, and pressure sintering

Copper Cored Ball
JuFeng
Copper Cored Ball
JuFeng
  1. Excellent BLT control, capable of constructing high-reliability and ultra-fine pitch 3D packaging structures
  2. High conductivity, high heat dissipation, and good electromigration resistance
  3. Provide solder alloy-coated copper core balls and gold-plated copper core balls
Solder Sphere
JuFeng
Solder Sphere
JuFeng
  1. Uniform sphericity and small diameter tolerance
  2. Excellent oxidation resistance, high solderability, and high reliability
  3. Available in 0.05mm - 1.0mm and customized sizes
Equipment Foundation with Active/Passive Vibration Isolation System
Ho Guang Machinery
Equipment Foundation with Active/Passive Vibration Isolation System
Ho Guang Machinery
  1. Design and Manufacturing of Anti-Vibration Steel Structures and Vibration Isolation Engineering
  2. Rigid Vibration-Isolated Equipment Base
Dry Pump Pre-treatment Plasma System and Dry Pump Remote Plasma System
LOT CES
Dry Pump Pre-treatment Plasma System and Dry Pump Remote Plasma System
LOT CES
  1. Extend the mean time between failures (MTBF) and service life of dry vacuum pumps
  2. Proven experience in high-volume manufacturing (HVM) at semiconductor fabs
Dry Pumps
LOT Vacuum
Dry Pumps
LOT Vacuum
  1. Process-oriented: models available for diffusion, CVD, dry etching, PVD, and other processes
  2. Predictive system for pump failures
  3. Ultra-energy efficient with exceptionally long mean time between failures (MTBF)