AccuSave AI Chiller Energy Saving System
ECOFIRST
AccuSave AI Chiller Energy Saving System
ECOFIRST
- Energy savings of 15% to 65%
- Improves air conditioning system efficiency
- Reduces operating costs
Oven
Despatch
Oven
Despatch
- With over a century of history, specializing in heat treatment oven technology
- Offering a full range from benchtop and cabinet ovens to ultra-large ovens, meeting the needs of various industries
Real-time Chemical Concentration Analyzer (Drug withdrawal cycle type)
Mega Crystal
Real-time Chemical Concentration Analyzer (Drug withdrawal cycle type)
Mega Crystal
- High Accuracy: Capable of detecting trace additives and metal ions (Au, Cu, Pd, Si, Ni, etc.) down to below 100 ppm
- Versatile Analysis: Suitable for mixed chemical solutions, capable of analyzing 6 to 8 components simultaneously
- Rapid Detection: No consumables required, analysis results in as fast as 10 seconds
Real-time Chemical Concentration Analyzer (Clip type)
Mega Crystal
Real-time Chemical Concentration Analyzer (Clip type)
Mega Crystal
- Non-contact Detection: No direct contact with chemical solutions, preventing contamination and loss
- High Temperature Tolerance: Capable of analyzing chemical solutions up to 160°C
- Flexible Usage: Wide concentration range supported, no hardware modification required for concentration changes
Equipment Performance and Failure Prevention Quick Screening Kit
SmartTag
Equipment Performance and Failure Prevention Quick Screening Kit
SmartTag
- Real-time monitoring and measurement of specific parameters such as vibration, temperature, and humidity
- Equipped with wireless transmission, allowing alert thresholds to be set and notifications to be sent
- AIoT edge computing device with a built-in data compression algorithm (Decay Rate)
Solid Wax for Wafer Slicing and Grinding
NIKKA SEIKO
Solid Wax for Wafer Slicing and Grinding
NIKKA SEIKO
- High-strength temporary bonding wax, with customizable strength requirements based on different materials and processes
- Easy to operate, with product options available based on operating temperature, working viscosity, and heat resistance
- Easy to clean, with tailored cleaning solutions available to meet customer needs, leaving no residual contamination
Wafer Laser Dicing Protective Coating Chemical
NIKKA SEIKO
Wafer Laser Dicing Protective Coating Chemical
NIKKA SEIKO
- Water-soluble protective solution that prevents laser-cutting byproducts from directly contacting or reattaching to the wafer
- Applicable to industries such as fan-out packaging, CIS sensor packaging, DDIC chip COG/COF packaging, and memory chip bumping packaging
- Excellent protection, easy to clean, and stable performance
Ion Beam Etching (IBE) Tool
Adnano
Ion Beam Etching (IBE) Tool
Adnano
- Ion source low-temperature etching
- Ion source physical vapor deposition (PVD)
- Dry etching
Factory Vision Automation System
TDV
Factory Vision Automation System
TDV
- Software developer and system integrator for front-end and back-end of Industrial IoT
- Security industry
- Intelligent transportation systems (ITS), Industry 4.0 applications, Smart City, and material handling/warehousing
Single-Wafer Wet Process Equipment
Cisom
Single-Wafer Wet Process Equipment
Cisom
- Short single-wafer processing time with high efficiency
- Strong particle removal capability, low breakage rate, and high reliability
- Reduced sulfuric acid consumption with enhanced cleaning performance, effectively lowering cleaning costs
SOI Wafer Smart Cut™ Technology Splitting Equipment
R2D Automation
SOI Wafer Smart Cut™ Technology Splitting Equipment
R2D Automation
- The world’s leading manufacturer of Smart Cut technology splitting equipment for SOI wafers
- Provides stand-alone systems or fully automated Smart Cut wafer splitting equipment integrated with horizontal/vertical furnaces
High-Temperature Wet Oxidation Furnace
Aloxtec
High-Temperature Wet Oxidation Furnace
Aloxtec
- Moisture oxidation of III-V compound semiconductor materials
- Moisture oxidation of VCSEL devices
- Moisture oxidation of AlGaAs DBR LED devices
Cleanroom Wipers
Texwipe
Cleanroom Wipers
Texwipe
- Ensure the wafer surface is clean and dust-free, which helps to ensure process stability and product quality
- Anti-static ability helps to protect the safety of wafers and processes
Adhesive for Bonding Ingot to Beam Prior to Slicing
NIKKA SEIKO
Adhesive for Bonding Ingot to Beam Prior to Slicing
NIKKA SEIKO
- Temporary adhesive specially developed for silicon ingot slicing processes (not for permanent fixing or packaging)
- Two-component epoxy resin used to bond workpieces to resin beams (slicing beams) or support carriers
- High adhesion strength, high hardness, and peelable
Liquid Wax for Wafer Temporary Wafer Bonding
NIKKA SEIKO
Liquid Wax for Wafer Temporary Wafer Bonding
NIKKA SEIKO
- Applicable to processes such as thin wafer backside processing, deep silicon etching, and TSV via formation
- Suitable for wafer-level packaging, compound semiconductors, and MEMS industries
- High temperature resistance, chemical corrosion resistance, easy to clean, and stable performance
Optical Edge Profile Inspection Tool
Delta Electronics
Optical Edge Profile Inspection Tool
Delta Electronics
- Helps identify problems in advance and take appropriate measures to reduce defect rates
- Automated inspection functions enable automatic detection and analysis, reducing manual operation
- Improves inspection efficiency and consistency
Rapid Thermal Processing
Premtek
Rapid Thermal Processing
Premtek
- Supports both 8” & 6” wafer production
- Configurable SMIF / Open cassette load port
- Compatible with both atmospheric / Vacuum process, Oxygen-free processing with O2 < 1 ppm
- SECS / GEM communication ready, Compliant with SEMI-S2/CE standards
PVD
Skytech
PVD
Skytech
- Can choose cavity configuration according to needs, highly customized, up to a maximum of 6 cavities
- Optional thin film processing architecture, ICP, degas, or long throw architecture
- Reactive sputtering can be optionally combined with in-situ pasting modules
- Highly automated with SECS/GEM
PVD Carbon
Skytech
PVD Carbon
Skytech
- Coating using high-vacuum physical methods
- Carbon film has high purity, high density, and few impurities
- Provide a good stair step coverage effect
- Special design to reduce particles
ALD
Skytech
ALD
Skytech
- High degree of customization and automation
- In response to high and low temperatures and charge damage concerns, Thermal ALD or PEALD can be chosen
- Patented intake design and showerhead system design for excellent uniformity
- Commonly used in processes such as Al2O3, SiO2, AlN, ZrO2, SiNX, HfO2, TiN, TiO2, and metal Mo
Temporary Bonding & De-Bonding
Skytech
Temporary Bonding & De-Bonding
Skytech
- Alignment accuracy less than ± 50um
- Specialized bubble-free construction method
- Can bond 150/150mm with the same size
- Suitable for applications in GaAs, GaN, SiC, LED, 3DIC, and other fields
Descum/Plasma Polish
Skytech
Descum/Plasma Polish
Skytech
- After developing with photoresist or PI, desicum can be used to remove the residue of PR or PI
- Removal of Laser Release Layer
- Dry etching is applicable to ABF
- Suitable for removing the damaged layer using plasma polishing after grinding SiC chips
TC Wafer Surface Temperature Sensor
Premtek
TC Wafer Surface Temperature Sensor
Premtek
- Correspond to wafers of various sizes and substrates of different materials
- Temperature range: -200 ℃~1200 ℃
- The number of sensors can be customized according to demand
- High specification accuracy: sensor to sensor ± 0.5°
Sustainable Water Treatment Solutions for Advanced Semiconductor Processes
NSS Water
Sustainable Water Treatment Solutions for Advanced Semiconductor Processes
NSS Water
- WET technology can reduce water consumption by up to 90%, thanks to its point-of-use process and ultra-high water purity
- WET’s simplified process (eliminating the need for reverse osmosis and filtration) can reduce energy consumption per liter of water by up to 50%
- Reduces water usage and enables reuse: Wet can serve as a point-of-use recovery system, returning water directly to the production process or discharging it to the wastewater treatment plant
Equipment Foundation with Active/Passive Vibration Isolation System
Ho Guang Machinery
Equipment Foundation with Active/Passive Vibration Isolation System
Ho Guang Machinery
- Design and Manufacturing of Anti-Vibration Steel Structures and Vibration Isolation Engineering
- Rigid Vibration-Isolated Equipment Base
Bellows Pumps for Wet Process and CMP Equipment
LOT CES
Bellows Pumps for Wet Process and CMP Equipment
LOT CES
- Precision and stable bellows pumps with proven experience in high-volume manufacturing (HVM) at semiconductor fabs
- Compared with other suppliers, we offer shorter lead times and more competitive pricing
Dry Pumps
LOT Vacuum
Dry Pumps
LOT Vacuum
- Process-oriented: models available for diffusion, CVD, dry etching, PVD, and other processes
- Predictive system for pump failures
- Ultra-energy efficient with exceptionally long mean time between failures (MTBF)
Gas Delivery Subsystems
Ichor
Gas Delivery Subsystems
Ichor
- Highly integrated design, reducing space requirements
- Applied in advanced 7nm/5nm/3nm/2nm diffusion, chemical vapor deposition (CVD), and dry etching equipment
- Providing customized products and services for equipment manufacturers
Ultra-Precision Mass Flow Controllers
Ichor
Ultra-Precision Mass Flow Controllers
Ichor
- Applied in advanced 7nm/5nm/3nm/2nm diffusion, chemical vapor deposition (CVD), and dry etching equipment
- Providing ultra-precise gas mass flow control for the semiconductor industry (AFC/AFCe: setpoint error within 1%)
2D/3D Optical Surface Measurement Tool
DIP-View
2D/3D Optical Surface Measurement Tool
DIP-View
- 2D and 3D measurement of roughness, warpage, and shape
- 2D and 3D surface defect measurement
- Thin film stress measurement
