Smart Clamp Meter
3Egreen
Smart Clamp Meter
3Egreen
  1. Completely wireless clamp meter with self-charging, no wiring required
  2. Real-time power consumption monitoring with equipment anomaly alerts
  3. Quick installation without shutdown, avoiding production downtime, with low implementation cost
Vibration-Resistant Metal Base Foot
TAIWAN NITTOKU
Vibration-Resistant Metal Base Foot
TAIWAN NITTOKU
  1. Seismic resistance up to magnitude 7, supporting equipment weights up to 4 tons
  2. Easy installation and reconfiguration, washable and reusable
  3. Floor-friendly alternative to traditional rivet fixing, suitable for cleanroom environments
Low-Frequency RF ID Reader/Writer
TAIWAN NITTOKU
Low-Frequency RF ID Reader/Writer
TAIWAN NITTOKU
  1. Smallest footprint in the industry, supporting multiple communication interfaces
  2. Outstanding communication performance even in environments with electromagnetic noise and metal interference
  3. Supports semiconductor industry SEMI standards (SECS-GEM)
AccuSave AI Chiller Energy Saving System
ECOFIRST
AccuSave AI Chiller Energy Saving System
ECOFIRST
  1. Energy savings of 15% to 65%
  2. Improves air conditioning system efficiency
  3. Reduces operating costs
Oven
Despatch
Oven
Despatch
  1. With over a century of history, specializing in heat treatment oven technology
  2. Offering a full range from benchtop and cabinet ovens to ultra-large ovens, meeting the needs of various industries
Thin Wafer Dicing Blade
ASAHI Diamond
Thin Wafer Dicing Blade
ASAHI Diamond
  1. Widely used in various packages such as glass, ceramics, and compound materials
  2. Customizable bonding agents to suit both high rigidity and high cutting force requirements
  3. Available in three types: resin blades, metal blades, and electroformed blades
Dressing Board for Dicing Blades
ASAHI Diamond
Dressing Board for Dicing Blades
ASAHI Diamond
  1. Suitable for wafer dicing blades
  2. Improves cutting efficiency and reduces time costs
  3. Reduces coolant consumption
Horizontal Furnace
TEMPRESS
Horizontal Furnace
TEMPRESS
  1. Provides versatile atmospheric and CVD process chambers, suitable for any type of silicon wafer
  2. Capable of batch processing 25–200 wafers per tube
  3. Fully automated vertical and horizontal furnaces for high-temperature oxidation and LPCVD applications
Process Chamber Gate Valve
V-TEX
Process Chamber Gate Valve
V-TEX
  1. No metal-to-metal friction inside the vacuum
  2. Streamlined design to reduce cost and space requirements
  3. Standard design supports 1 million cycles, featuring high durability and low maintenance
Wafer Surface Inspection System
TAKANO
Wafer Surface Inspection System
TAKANO
  1. High-speed color/monochrome inspection for wafer defects
  2. Optional ring illumination and transmitted illumination, each compatible with color filter sets
  3. Enhanced defect detection capability & productivity
Wafer Surface Particle Scanning Equipment
TAKANO
Wafer Surface Particle Scanning Equipment
TAKANO
  1. Capable of detecting wafer surface particles or defects
  2. Utilizes a violet-LD surface analyzer to effectively reduce operating costs
  3. High performance, high quality, and high measurement speed with easy operation
ALTEX Bump Height Measurement Equipment
TAKANO
ALTEX Bump Height Measurement Equipment
TAKANO
  1. High-precision bump height and coplanarity measurement with 3σ ≤ 1.0 μm
  2. Inspection time per sample is less than 2 seconds. With proprietary processing algorithms and dedicated hardware, tens of thousands of high-density bumps can be measured in an extremely short time
  3. Capable of measuring circular bumps as small as φ30 μm
Circuit Probing Equipment
Plum Five
Circuit Probing Equipment
Plum Five
  1. Capable of probing standard wafers, thinned wafers, diced wafers, and substrates with special shapes
  2. Automatically transported from carriers via a controlled transfer system for subsequent inspection
  3. Supports multi-zone measurement
Double-Sided Lithography Inspection System
SEIWA Optical
Double-Sided Lithography Inspection System
SEIWA Optical
  1. Wide range of applications, including exposure offset inspection, defect inspection, and CoWoS HBM offset inspection
  2. Top-side alignment and back-side alignment processes
  3. 3D inspection technologies such as white light interferometry, confocal microscopy, and AFM
eFLOW Anti-Static System for Ultrapure Water
DIC
eFLOW Anti-Static System for Ultrapure Water
DIC
  1. Simple structure with low failure rate
  2. Unique piping distribution design for easy resistivity control and excellent stability
  3. Long service life of the CO₂ supply module
Real-time Chemical Concentration Analyzer (Drug withdrawal cycle type)
Mega Crystal
Real-time Chemical Concentration Analyzer (Drug withdrawal cycle type)
Mega Crystal
  1. High Accuracy: Capable of detecting trace additives and metal ions (Au, Cu, Pd, Si, Ni, etc.) down to below 100 ppm
  2. Versatile Analysis: Suitable for mixed chemical solutions, capable of analyzing 6 to 8 components simultaneously
  3. Rapid Detection: No consumables required, analysis results in as fast as 10 seconds
Real-time Chemical Concentration Analyzer (Clip type)
Mega Crystal
Real-time Chemical Concentration Analyzer (Clip type)
Mega Crystal
  1. Non-contact Detection: No direct contact with chemical solutions, preventing contamination and loss
  2. High Temperature Tolerance: Capable of analyzing chemical solutions up to 160°C
  3. Flexible Usage: Wide concentration range supported,  no hardware modification required for concentration changes
Wafer Cleaner
LJH
Wafer Cleaner
LJH
  1. Chemical supply system, wet bench and single-wafer cleaning machine
  2. Professional facility engineering services
Equipment Performance and Failure Prevention Quick Screening Kit
SmartTag
Equipment Performance and Failure Prevention Quick Screening Kit
SmartTag
  1. Real-time monitoring and measurement of specific parameters such as vibration, temperature, and humidity
  2. Equipped with wireless transmission, allowing alert thresholds to be set and notifications to be sent
  3. AIoT edge computing device with a built-in data compression algorithm (Decay Rate)
Solid Wax for Wafer Slicing and Grinding
NIKKA SEIKO
Solid Wax for Wafer Slicing and Grinding
NIKKA SEIKO
  1. High-strength temporary bonding wax, with customizable strength requirements based on different materials and processes
  2. Easy to operate, with product options available based on operating temperature, working viscosity, and heat resistance
  3. Easy to clean, with tailored cleaning solutions available to meet customer needs, leaving no residual contamination
Wafer Laser Dicing Protective Coating Chemical
NIKKA SEIKO
Wafer Laser Dicing Protective Coating Chemical
NIKKA SEIKO
  1. Water-soluble protective solution that prevents laser-cutting byproducts from directly contacting or reattaching to the wafer
  2. Applicable to industries such as fan-out packaging, CIS sensor packaging, DDIC chip COG/COF packaging, and memory chip bumping packaging
  3. Excellent protection, easy to clean, and stable performance
Factory Vision Automation System
TDV
Factory Vision Automation System
TDV
  1. Software developer and system integrator for front-end and back-end of Industrial IoT
  2. Security industry
  3. Intelligent transportation systems (ITS), Industry 4.0 applications, Smart City, and material handling/warehousing
Single-Wafer Wet Process Equipment
Cisom
Single-Wafer Wet Process Equipment
Cisom
  1. Short single-wafer processing time with high efficiency
  2. Strong particle removal capability, low breakage rate, and high reliability
  3. Reduced sulfuric acid consumption with enhanced cleaning performance, effectively lowering cleaning costs
Resin Type Ingot Slicing Beam
DWi DOW INNOVATION
Resin Type Ingot Slicing Beam
DWi DOW INNOVATION
  1. Used in band saw and wire saw processes for silicon ingot slicing, improving production quality
  2. Customizable in different sizes according to customer requirements
  3. Easily compatible with adhesive products, enhancing production efficiency
Cleanroom Wipers
Texwipe
Cleanroom Wipers
Texwipe
  1. Ensure the wafer surface is clean and dust-free, which helps to ensure process stability and product quality
  2. Anti-static ability helps to protect the safety of wafers and processes
Adhesive for Bonding Ingot to Beam Prior to Slicing
NIKKA SEIKO
Adhesive for Bonding Ingot to Beam Prior to Slicing
NIKKA SEIKO
  1. Temporary adhesive specially developed for silicon ingot slicing processes (not for permanent fixing or packaging)
  2. Two-component epoxy resin used to bond workpieces to resin beams (slicing beams) or support carriers
  3. High adhesion strength, high hardness, and peelable
Liquid Wax for Wafer Temporary Wafer Bonding
NIKKA SEIKO
Liquid Wax for Wafer Temporary Wafer Bonding
NIKKA SEIKO
  1. Applicable to processes such as thin wafer backside processing, deep silicon etching, and TSV via formation
  2. Suitable for wafer-level packaging, compound semiconductors, and MEMS industries
  3. High temperature resistance, chemical corrosion resistance, easy to clean, and stable performance
Wet Bench
STN
Wet Bench
STN
  1. Customizable design and production
  2. Mostly adopts an integrated non-jointed design, which is not easy to produce particles and leakage, and has low maintenance costs
  3. Can be used for wafer cleaning to remove surface dust particles, etching, and photoresist removal
CDU
STN
CDU
STN
  1. 1. Imported materials and integrated non-jointed design are used , which is not easy to cause liquid leakage and has low maintenance costs
  2. 2. Customizable
Sintered Silver Paste
JuFeng
Sintered Silver Paste
JuFeng
  1. High-power electronic component packaging material, using advanced nano silver technology
  2. Can be sintered and applied directly on copper plates without gold or silver plating
  3. Provide dispensing, screen printing, pressureless, and pressure sintering

Copper Cored Ball
JuFeng
Copper Cored Ball
JuFeng
  1. Excellent BLT control, capable of constructing high-reliability and ultra-fine pitch 3D packaging structures
  2. High conductivity, high heat dissipation, and good electromigration resistance
  3. Provide solder alloy-coated copper core balls and gold-plated copper core balls
Solder Sphere
JuFeng
Solder Sphere
JuFeng
  1. Uniform sphericity and small diameter tolerance
  2. Excellent oxidation resistance, high solderability, and high reliability
  3. Available in 0.05mm - 1.0mm and customized sizes
Optical Edge Profile Inspection Tool
Delta Electronics
Optical Edge Profile Inspection Tool
Delta Electronics
  1. Helps identify problems in advance and take appropriate measures to reduce defect rates
  2. Automated inspection functions enable automatic detection and analysis, reducing manual operation
  3. Improves inspection efficiency and consistency
Rapid Thermal Processing
Premtek
Rapid Thermal Processing
Premtek
  1. Supports both 8” & 6” wafer production
  2. Configurable SMIF / Open cassette load port
  3. Compatible with both atmospheric / Vacuum process, Oxygen-free processing with O2 < 1 ppm
  4. SECS / GEM communication ready, Compliant with SEMI-S2/CE standards
PVD
Skytech
PVD
Skytech
  1. Can choose cavity configuration according to needs, highly customized, up to a maximum of 6 cavities
  2. Optional thin film processing architecture, ICP, degas, or long throw architecture
  3. Reactive sputtering can be optionally combined with in-situ pasting modules
  4. Highly automated with SECS/GEM
PVD Carbon
Skytech
PVD Carbon
Skytech
  1. Coating using high-vacuum physical methods
  2. Carbon film has high purity, high density, and few impurities
  3. Provide a good stair step coverage effect
  4. Special design to reduce particles
ALD
Skytech
ALD
Skytech
  1. High degree of customization and automation
  2. In response to high and low temperatures and charge damage concerns, Thermal ALD or PEALD can be chosen
  3. Patented intake design and showerhead system design for excellent uniformity
  4. Commonly used in processes such as Al2O3, SiO2, AlN, ZrO2, SiNX, HfO2, TiN, TiO2, and metal Mo
Temporary Bonding & De-Bonding
Skytech
Temporary Bonding & De-Bonding
Skytech
  1. Alignment accuracy less than ± 50um
  2. Specialized bubble-free construction method
  3. Can bond 150/150mm with the same size
  4. Suitable for applications in GaAs, GaN, SiC, LED, 3DIC, and other fields
TC Wafer Surface Temperature Sensor
Premtek
TC Wafer Surface Temperature Sensor
Premtek
  1. Correspond to wafers of various sizes and substrates of different materials
  2. Temperature range: -200 ℃~1200 ℃
  3. The number of sensors can be customized according to demand
  4. High specification accuracy: sensor to sensor ± 0.5°
Active/Passive Vibration Isolation Systems
IDE
Active/Passive Vibration Isolation Systems
IDE
  1. Provides 40 dB isolation at 5 Hz and 60 dB isolation at 20 Hz
  2. Based on different environmental conditions and equipment vibration isolation requirements, computer simulations are used to offer customers various models and configurations
High-Frequency and Low-Frequency Vibration Isolation Tables for Electron Microscopes
IDE
High-Frequency and Low-Frequency Vibration Isolation Tables for Electron Microscopes
IDE
  1. A unique solution specifically designed for nanotechnology laboratory applications of electron microscopes
  2. Featuring a distinctive floor feed-forward technology that delivers outstanding vibration isolation even below 1 Hz
  3. Provides the most effective isolation against high-amplitude disturbances
Sustainable Water Treatment Solutions for Advanced Semiconductor Processes
NSS Water
Sustainable Water Treatment Solutions for Advanced Semiconductor Processes
NSS Water
  1. WET technology can reduce water consumption by up to 90%, thanks to its point-of-use process and ultra-high water purity
  2. WET’s simplified process (eliminating the need for reverse osmosis and filtration) can reduce energy consumption per liter of water by up to 50%
  3. Reduces water usage and enables reuse: Wet can serve as a point-of-use recovery system, returning water directly to the production process or discharging it to the wastewater treatment plant
Equipment Foundation with Active/Passive Vibration Isolation System
Ho Guang Machinery
Equipment Foundation with Active/Passive Vibration Isolation System
Ho Guang Machinery
  1. Design and Manufacturing of Anti-Vibration Steel Structures and Vibration Isolation Engineering
  2. Rigid Vibration-Isolated Equipment Base
2D/3D Optical Surface Measurement Tool
DIP-View
2D/3D Optical Surface Measurement Tool
DIP-View
  1. 2D and 3D measurement of roughness, warpage, and shape
  2. 2D and 3D surface defect measurement
  3. Thin film stress measurement