1. 1. The number of nozzles can be changed to transfer chips of various sizes (up to 16 pieces)
2. Use 3 types of cameras to perform 6-side inspection (top/back/side)
3. The input and tray modes can be adjusted according to needs

1. Integrated human-machine operation system, continuous automated production, high work efficiency, saving labor costs, electricity and process time
2. FEC heating, rapid heating and good uniformity
3. High-quality stainless steel material, the surface is physically and chemically polished to ensure cleanliness

1. Reduce CeO2 by 70% and recycle 60% of wastewater
2. Automatic batch recycling production without changing parameters
3. Same polishing yield as stock solution

1. 200mm and 300mm integrated fully automated conveying
2. Each tube operates independently
3. Slip free

1. Improve power quality and increase effective power
2. Improve power generation capacity and reduce degradation rate
3. ESG products are non-toxic, green energy and environmentally friendly

1. Measure the dimensions of a specified location or pattern on a wafer/bare wafer after integrated circuit formation and dicing.
2. Generate a 3D model based on the information obtained when measuring height, and use it as a simplified SEM function.
3. Can also perform mixed measurements of line width (2D) x height (3D)

1. We have extensive experience in various inspection projects such as power devices, CMOS, crystals (tuning forks), and inkjet heads.
2. We can perform non-destructive precision measurement and inspection of the positional offset of the patterns on the front and back of wafers, and can also handle wafer surface-surface and wafer surface-interface (internal pattern) inspections.
3. Equipped with a dedicated DSI optical engine for high-precision measurement; the repeatability of the measurement can reach 3σ≦0.2~0.02μm.

1. High strength: resistant to pressure, folding and breaking, can achieve lighter and thinner components and improve heat dissipation efficiency
2. High thermal conductivity, good heat dissipation effect, good insulation performance, no leakage risk
3. Suitable for ultra-fast charging, new energy vehicles and various power components

1. Can shorten cutting time and reduce chip damage
2. Thin the chip
3. After cutting, the thickness of the chip remains the same

1. Wafer chamfering
2. Applicable to 2"~12" sizes
3. Single groove and multi-groove types

1. Double-sided thinning grinding wheel
2. Use ultra-fine abrasive grain to increase grinding force
3. Grinding wheels of different specifications can be customized according to customer equipment requirements

1. Improve polishing performance
2. Reduce scratches on wafer surface
3. Different types can be customized according to customer equipment requirements

1. Excellent heat transfer function and efficiency, good temperature regulation function
2. High specific heat capacity, high dielectric strength, low dielectric constant
3. Excellent chemical compatibility, high boiling point

1. Specially used for VCSEL aperture measurement
2. Supports manual/automatic
3. Can correspond to 20/50/100x CCD lens

1. Extremely high lubricity can reduce cutting resistance and the possibility of fragmentation during wheel cutting.
2. Applicable to CIS sensor packaging, MEMS packaging, fan-out packaging and other industries.
3. Can improve cutting efficiency, good protection effect, significantly reduce splinters, easy to clean.

1. Compatible with 4-inch, 6-inch, and 8-inch SiC thinning machines
2. Can thin 150/150mm bonded wafers of the same size
3. Provides non-contact thinning real-time monitoring

1. High stability and high reliability
2. Excellent electrical and thermal conductivity
3. High strength and good fatigue resistance

1. Defect detection system - resolution: 1.7um; hole inspection depth inspection
2. AOI AI screening function to prevent dirty particles from being screened

1. Improve wafer process efficiency and shorten production cycle
2. Improve the stability of subsequent processes
3. Automation function can automatically adjust parameters and perform processing, reducing the need for manual work

1. Comprehensive inspection, AOI AI intelligent inspection algorithm, supplemented by all-round light and dark three-field optical imaging
2. One machine with multiple functions, integrating resistance, flatness, and inspection modules
3. Flexible production: fast size switching, automatic line change
4. The degree of automation can be freely matched with various defect detection according to customer requirements, while achieving automation

1. High-precision absolute reflectivity measurement (multi-layer film thickness, optical constants) using microspectroscopy
2. High-speed measurement in 1.1 seconds
3. Equipped with marco function, various measurement conditions can be customized

1. New monolithic atmospheric pressure CVD for hard mask and ILD oxide insulating layer
2. New monolithic design can cope with warping of third generation semiconductor SiC wafers

1. High-purity CVD silicon carbide crystal growth raw material
2. Large particle size, faster, thicker, and higher purity crystal growth
3. Low crystal growth cost

1. Avoids waste of resources and increased production costs
2. Effectively ensures product quality and safety, and can detect potential problems in advance
3. Equipped with advanced image processing and analysis software to automatically identify and classify different types of defects

1. Replace manual labor, maintain consistent product quality, and effectively reduce the risk of wafer breakage.
2. Automatic vacuum sealing ensures that the FOUP will not be damaged. Monitoring systems are installed at key sites to keep records and avoid losses caused by customer complaints.
3. E84 communication, compatible with the OHT overhead crane system and the MR system's automated loading function, can be put into large-scale production.

1. Using PLC touch screen control system, equipment parameter setting and operation are simple and convenient, and the system operation stability is high.
2. Using cylinder pressurization method, closed-loop control of pressure is achieved through electric proportional valve control to ensure extremely high pressure accuracy and stability.
3. The polishing plate and upper pressure plate are equipped with water cooling function to ensure high efficiency of polishing liquid while reducing deformation of the polishing plate surface.

1. Chemical resistance, showing excellent stability under most chemicals
2. Heat resistance of nearly 300 degrees Celsius, still able to maintain the physical properties of rubber at high temperatures
3. Extend the seal life and average maintenance interval time, and improve the yield rate of semiconductor products

1. Use patented technology to recycle and replace 70% of grinding powder/polishing powder
2. Recycle 60% of water resources
3. Environmentally friendly and save raw material costs

1. After irradiation with ultraviolet rays of a specific wavelength, the adhesion is reduced to an extremely low level, making it easy to remove the adhesive and film from the adhered object, making it easier to process.
2. Suitable for wafer grinding, cutting processes, and cutting and transferring of various substrates or semiconductor electronics industries

1. Surfactants used after final polishing of silicon wafers and glass materials can effectively inhibit particles, HAZE and prevent metal contamination

1. Suitable for high-purity cleaning of various semiconductor materials after polishing and cleaning of liquid/solid wax produced by Nichika Seiko
2. Suitable for precision cleaning of equipment, abrasives and equipment parts that come into contact with wafers
3. Low erosion rate, can be diluted with pure water, safer and more economical

1. Inorganic cleaning agent, good for degreasing, suitable for wax removal and cleaning, with excellent effect
2. Does not contain organic solvents, suitable for cleaning quartz, crystal, ceramics and other materials
3. Safe and economical

1. Completely wireless clamp meter with self-charging, no wiring required
2. Real-time power consumption monitoring with equipment anomaly alerts
3. Quick installation without shutdown, avoiding production downtime, with low implementation cost

1. Seismic resistance up to magnitude 7, supporting equipment weights up to 4 tons
2. Easy installation and reconfiguration, washable and reusable
3. Floor-friendly alternative to traditional rivet fixing, suitable for cleanroom environments

1. Smallest footprint in the industry, supporting multiple communication interfaces
2. Outstanding communication performance even in environments with electromagnetic noise and metal interference
3. Supports semiconductor industry SEMI standards (SECS-GEM)

1. Energy savings of 15% to 65%
2. Improves air conditioning system efficiency
3. Reduces operating costs

1. With over a century of history, specializing in heat treatment oven technology
2. Offering a full range from benchtop and cabinet ovens to ultra-large ovens, meeting the needs of various industries

1. Widely used in various packages such as glass, ceramics, and compound materials
2. Customizable bonding agents to suit both high rigidity and high cutting force requirements
3. Available in three types: resin blades, metal blades, and electroformed blades

1. Suitable for wafer dicing blades
2. Improves cutting efficiency and reduces time costs
3. Reduces coolant consumption

1. Provides versatile atmospheric and CVD process chambers, suitable for any type of silicon wafer
2. Capable of batch processing 25–200 wafers per tube
3. Fully automated vertical and horizontal furnaces for high-temperature oxidation and LPCVD applications

1. No metal-to-metal friction inside the vacuum
2. Streamlined design to reduce cost and space requirements
3. Standard design supports 1 million cycles, featuring high durability and low maintenance

1. High-speed color/monochrome inspection for wafer defects
2. Optional ring illumination and transmitted illumination, each compatible with color filter sets
3. Enhanced defect detection capability & productivity

1. Capable of detecting wafer surface particles or defects
2. Utilizes a violet-LD surface analyzer to effectively reduce operating costs
3. High performance, high quality, and high measurement speed with easy operation

1. High-precision bump height and coplanarity measurement with 3σ ≤ 1.0 μm
2. Inspection time per sample is less than 2 seconds. With proprietary processing algorithms and dedicated hardware, tens of thousands of high-density bumps can be measured in an extremely short time
3. Capable of measuring circular bumps as small as φ30 μm

1. Capable of probing standard wafers, thinned wafers, diced wafers, and substrates with special shapes
2. Automatically transported from carriers via a controlled transfer system for subsequent inspection
3. Supports multi-zone measurement

1. Wide range of applications, including exposure offset inspection, defect inspection, and CoWoS HBM offset inspection
2. Top-side alignment and back-side alignment processes
3. 3D inspection technologies such as white light interferometry, confocal microscopy, and AFM

1. Simple structure with low failure rate
2. Unique piping distribution design for easy resistivity control and excellent stability
3. Long service life of the CO₂ supply module

1. High Accuracy: Capable of detecting trace additives and metal ions (Au, Cu, Pd, Si, Ni, etc.) down to below 100 ppm
2. Versatile Analysis: Suitable for mixed chemical solutions, capable of analyzing 6 to 8 components simultaneously
3. Rapid Detection: No consumables required, analysis results in as fast as 10 seconds

1. Non-contact Detection: No direct contact with chemical solutions, preventing contamination and loss
2. High Temperature Tolerance: Capable of analyzing chemical solutions up to 160°C
3. Flexible Usage: Wide concentration range supported,  no hardware modification required for concentration changes

1. Chemical supply system, wet bench and single-wafer cleaning machine
2. Professional facility engineering services

1. Real-time monitoring and measurement of specific parameters such as vibration, temperature, and humidity
2. Equipped with wireless transmission, allowing alert thresholds to be set and notifications to be sent
3. AIoT edge computing device with a built-in data compression algorithm (Decay Rate)

1. High-strength temporary bonding wax, with customizable strength requirements based on different materials and processes
2. Easy to operate, with product options available based on operating temperature, working viscosity, and heat resistance
3. Easy to clean, with tailored cleaning solutions available to meet customer needs, leaving no residual contamination

1. Water-soluble protective solution that prevents laser-cutting byproducts from directly contacting or reattaching to the wafer
2. Applicable to industries such as fan-out packaging, CIS sensor packaging, DDIC chip COG/COF packaging, and memory chip bumping packaging
3. Excellent protection, easy to clean, and stable performance

1. Ion source low-temperature etching
2. Ion source physical vapor deposition (PVD)
3. Dry etching

1. Software developer and system integrator for front-end and back-end of Industrial IoT
2. Security industry
3. Intelligent transportation systems (ITS), Industry 4.0 applications, Smart City, and material handling/warehousing

1. Short single-wafer processing time with high efficiency
2. Strong particle removal capability, low breakage rate, and high reliability
3. Reduced sulfuric acid consumption with enhanced cleaning performance, effectively lowering cleaning costs

1. The world’s leading manufacturer of Smart Cut technology splitting equipment for SOI wafers
2. Provides stand-alone systems or fully automated Smart Cut wafer splitting equipment integrated with horizontal/vertical furnaces

1. Moisture oxidation of III-V compound semiconductor materials
2. Moisture oxidation of VCSEL devices
3. Moisture oxidation of AlGaAs DBR LED devices

1. Used in band saw and wire saw processes for silicon ingot slicing, improving production quality
2. Customizable in different sizes according to customer requirements
3. Easily compatible with adhesive products, enhancing production efficiency

1. Applied in TN-LCD, STN-LCD products
2. Main glass material used in touch panels
3. Can be used as the main material of the protective layer glass on the upper layer of the touch panel
4. Ultra-thin alkali glass
5. Global flat glass market share is 50%
6. Glass thickness: 0.28t~1.1t
7. Maximum motherboard glass size: G6

1. Glanova for smartphone
2. Chemically strengthened thin glass for Automotive applications
3. High and sufficient strength
4. Easy heat 3D forming by its low softening point
5. Lower cost than other competitive materials

1. High-speed focusing microscope system with transmission and reflection modes
2. Efficient image processing and intelligent algorithms, magnification up to 100 times
3. Full-area measurement, no non-inspection area

1. Applicable to defect detection of various panels such as array, color film, touch screen and organic light-emitting diode
2. Maximum measurement accuracy is 1.0 micron
3. Maximum detection speed can be customized

1. High-speed focusing microscope system with transmission and reflection modes
2. Efficient image processing and intelligent algorithms, magnification up to 100 times
3. Full-area measurement, no non-inspection area

1. All-round spray pattern improves cleaning under low-distance components and eliminates shadow effects
2. Adopts mixed spray technology
3. Provides a variety of integrated design functions to save chemicals and electricity and reduce consumption

1. With strict closed-loop process control, it is designed for today's high-throughput assembly environment
2. It significantly reduces the thermal difference of the product and uses less energy
3. It reduces maintenance requirements and lowers the cost of ownership through cutting-edge flux processing technology

1. ± 35μ 3 Sigma dispensing accuracy at full speed
2. Innovative board grading options that expand the dispensing area in the X direction by 1-3 times, with a maximum processing size of 900 mm
3. Patented tilt and rotation technology that reduces KOZ and improves capillary flow of bottom fill

1. An optimized system processing speed can increase the margin of key printing parameters
2. Wet printing accuracy improved by 25%: built-in ±8 micron alignment accuracy and ±15 micron printing repeatability (≥2 Cpk @ 6σ)
3. No printing deviation: high-precision pressure sensor can eliminate pressure changes before and after, keeping the pressure of the entire surface constant

High-Resolution Semi-Automatic and Automatic Mask Aligner/Exposure Systems for LED, Compound Semiconductor, and Advanced Packaging Applications

1. Ensure the wafer surface is clean and dust-free, which helps to ensure process stability and product quality
2. Anti-static ability helps to protect the safety of wafers and processes

1. Temporary adhesive specially developed for silicon ingot slicing processes (not for permanent fixing or packaging)
2. Two-component epoxy resin used to bond workpieces to resin beams (slicing beams) or support carriers
3. High adhesion strength, high hardness, and peelable

1. Applicable to processes such as thin wafer backside processing, deep silicon etching, and TSV via formation
2. Suitable for wafer-level packaging, compound semiconductors, and MEMS industries
3. High temperature resistance, chemical corrosion resistance, easy to clean, and stable performance

1. Customizable design and production
2. Mostly adopts an integrated non-jointed design, which is not easy to produce particles and leakage, and has low maintenance costs
3. Can be used for wafer cleaning to remove surface dust particles, etching, and photoresist removal

1. 1. Imported materials and integrated non-jointed design are used , which is not easy to cause liquid leakage and has low maintenance costs
2. 2. Customizable

1. High-power electronic component packaging material, using advanced nano silver technology
2. Can be sintered and applied directly on copper plates without gold or silver plating
3. Provide dispensing, screen printing, pressureless, and pressure sintering

1. Excellent BLT control, capable of constructing high-reliability and ultra-fine pitch 3D packaging structures
2. High conductivity, high heat dissipation, and good electromigration resistance
3. Provide solder alloy-coated copper core balls and gold-plated copper core balls

1. Uniform sphericity and small diameter tolerance
2. Excellent oxidation resistance, high solderability, and high reliability
3. Available in 0.05mm - 1.0mm and customized sizes

1. Helps identify problems in advance and take appropriate measures to reduce defect rates
2. Automated inspection functions enable automatic detection and analysis, reducing manual operation
3. Improves inspection efficiency and consistency

1. Supports both 8” & 6” wafer production
2. Configurable SMIF / Open cassette load port
3. Compatible with both atmospheric / Vacuum process, Oxygen-free processing with O2 < 1 ppm
4. SECS / GEM communication ready, Compliant with SEMI-S2/CE standards

1. Can choose cavity configuration according to needs, highly customized, up to a maximum of 6 cavities
2. Optional thin film processing architecture, ICP, degas, or long throw architecture
3. Reactive sputtering can be optionally combined with in-situ pasting modules
4. Highly automated with SECS/GEM

1. Coating using high-vacuum physical methods
2. Carbon film has high purity, high density, and few impurities
3. Provide a good stair step coverage effect
4. Special design to reduce particles

1. High degree of customization and automation
2. In response to high and low temperatures and charge damage concerns, Thermal ALD or PEALD can be chosen
3. Patented intake design and showerhead system design for excellent uniformity
4. Commonly used in processes such as Al2O3, SiO2, AlN, ZrO2, SiNX, HfO2, TiN, TiO2, and metal Mo

1. Alignment accuracy less than ± 50um
2. Specialized bubble-free construction method
3. Can bond 150/150mm with the same size
4. Suitable for applications in GaAs, GaN, SiC, LED, 3DIC, and other fields

1. After developing with photoresist or PI, desicum can be used to remove the residue of PR or PI
2. Removal of Laser Release Layer
3. Dry etching is applicable to ABF
4. Suitable for removing the damaged layer using plasma polishing after grinding SiC chips

1. Correspond to wafers of various sizes and substrates of different materials
2. Temperature range: -200 ℃~1200 ℃
3. The number of sensors can be customized according to demand
4. High specification accuracy: sensor to sensor ± 0.5°

1. Provides 40 dB isolation at 5 Hz and 60 dB isolation at 20 Hz
2. Based on different environmental conditions and equipment vibration isolation requirements, computer simulations are used to offer customers various models and configurations

1. A unique solution specifically designed for nanotechnology laboratory applications of electron microscopes
2. Featuring a distinctive floor feed-forward technology that delivers outstanding vibration isolation even below 1 Hz
3. Provides the most effective isolation against high-amplitude disturbances

1. WET technology can reduce water consumption by up to 90%, thanks to its point-of-use process and ultra-high water purity
2. WET’s simplified process (eliminating the need for reverse osmosis and filtration) can reduce energy consumption per liter of water by up to 50%
3. Reduces water usage and enables reuse: Wet can serve as a point-of-use recovery system, returning water directly to the production process or discharging it to the wastewater treatment plant

1. Reduced KOZ (Keep-Out Zone)
2. Simplified process (no need for flux removal or underfill)
3. Excellent solder joint reliability

1. Using formic acid reflow technology, eliminating the need for flux coating and cleaning
2. Simple process, low cost, and effective in increasing productivity
3. Applicable to 6-inch, 8-inch, and 12-inch standard as well as warped wafers

1. Minimal heat-affected zone with high-precision microfabrication, suppressing microcracks and supporting processing down to φ0.1 mm
2. Arbitrary shapes with straight cutting, not limited by focal depth, ensuring no edge inclination
3. Compatible with various materials, enabling the processing of both semiconductors and high-hardness materials

1. Design and Manufacturing of Anti-Vibration Steel Structures and Vibration Isolation Engineering
2. Rigid Vibration-Isolated Equipment Base

1. Improved film quality: reduces oxygen vacancies and defect density, enhancing dielectric reliability (TDDB, BTI)
2. Excellent uniformity: under high pressure, the higher reactivity of oxygen or nitrogen ensures both wafer-to-wafer and within-wafer uniformity
3. Wide applicability: suitable for SiO₂/SiON gate oxides, high-k dielectrics (e.g., HfO₂, Al₂O₃), as well as metal electrode interface repair

1. PI/PBI curing furnace tubes for advanced semiconductor packaging
2. Wafer baking furnace tubes for simulating harsh environments

1. Precision and stable bellows pumps with proven experience in high-volume manufacturing (HVM) at semiconductor fabs
2. Compared with other suppliers, we offer shorter lead times and more competitive pricing

1. Extend the mean time between failures (MTBF) and service life of dry vacuum pumps
2. Proven experience in high-volume manufacturing (HVM) at semiconductor fabs

1. Process-oriented: models available for diffusion, CVD, dry etching, PVD, and other processes
2. Predictive system for pump failures
3. Ultra-energy efficient with exceptionally long mean time between failures (MTBF)

1. Highly integrated design, reducing space requirements
2. Applied in advanced 7nm/5nm/3nm/2nm diffusion, chemical vapor deposition (CVD), and dry etching equipment
3. Providing customized products and services for equipment manufacturers

1. Applied in advanced 7nm/5nm/3nm/2nm diffusion, chemical vapor deposition (CVD), and dry etching equipment
2. Providing ultra-precise gas mass flow control for the semiconductor industry (AFC/AFCe: setpoint error within 1%)

TIM1 thermal paste and various materials for advanced packaging of AI and HPC chips

1. 2D and 3D measurement of roughness, warpage, and shape
2. 2D and 3D surface defect measurement
3. Thin film stress measurement