Smart current hook meter
Green
Smart current hook meter
Green
  1. Fully wireless current hook meter, self-charging without the need for wiring
  2. Real-time monitoring of power consumption, which can provide equipment abnormality warnings
  3. Quick installation without downtime, no waste of production capacity and working hours, low construction cost
Shockproof metal feet
Taiwan Japanese Special
Shockproof metal feet
Taiwan Japanese Special
  1. Withstands earthquakes of 7 levels and supports equipment weighing up to 4 tons
  2. Easy to install and change settings, can be washed and reused
  3. Does not damage the floor, replaces traditional rivet fixings, and is suitable for dust-free environments
Low frequency RFID reader
Taiwan Japanese Special
Low frequency RFID reader
Taiwan Japanese Special
  1. The smallest size in the industry, supporting many communication interfaces
  2. Excellent communication performance in electromagnetic noise and metal environments
  3. Supports SEMI specifications (SECS, HSMS) of semiconductor industry standards
Six-sided inspection and transfer equipment
Taiwan Japanese Special
Six-sided inspection and transfer equipment
Taiwan Japanese Special
  1. 1. The number of nozzles can be changed to transfer chips of various sizes (up to 16)
  2. Use 3 types of cameras to perform 6-sided inspection (top/back/side)
  3. Input and tray modes can be adjusted according to needs
Fully automatic vertical tube furnace
Zhen Ping
Fully automatic vertical tube furnace
Zhen Ping
  1. Integrated human-machine operation system, continuous automated production, high work efficiency, saving labor costs, electricity and process time
  2. FEC heating, rapid heating and good uniformity
  3. High-quality stainless steel material, the surface is physically and chemically polished to ensure cleanliness
AccuSave AI Air Conditioning Energy Saving Software
Taiwan Love Clean
AccuSave AI Air Conditioning Energy Saving Software
Taiwan Love Clean
  1. Energy saving rate 15% ~ 65%
  2. Improve air conditioning system efficiency
  3. Reduce operating costs
Oven
Despatch
Oven
Despatch
  1. With a century-old history, we focus on heat treatment oven technology.
  2. We provide ovens ranging from tabletop, cabinet to super large to meet the needs of various industries.
Recycling system
Ontario
Recycling system
Ontario
  1. Reduce CeO2 by 70% and recycle 60% of waste water
  2. Automatic batch recycling production without changing parameters
  3. Same polishing yield as stock solution
Cutting knife
ASAHI Diamond
Cutting knife
ASAHI Diamond
  1. Widely used in various PKGs such as glass, ceramics, and compounds
  2. Customizable binder suitable for high rigidity and high cutting force
  3. Available in three types: resin knife, metal knife, and electroforming knife
Sharpening Board
ASAHI Diamond
Sharpening Board
ASAHI Diamond
  1. Suitable for wafer cutting blades
  2. Improve cutting efficiency and reduce time cost
  3. Reduce the amount of coolant used
Horizontal furnace tube
TEMPRESS
Horizontal furnace tube
TEMPRESS
  1. Provides multi-purpose atmospheric and CVD processing chambers suitable for any type of silicon wafers
  2. Can batch process 25-1000 wafers per tube
  3. Fully automated vertical and horizontal furnaces, can be applied to high temperature oxidation and LPCVD
Horizontal furnace tube
BTU
Horizontal furnace tube
BTU
  1. 200mm and 300mm integrated fully automated conveying
  2. Each tube operates independently
  3. Slip free
Sliding Vacuum Valve
V-TEX
Sliding Vacuum Valve
V-TEX
  1. There is no friction between metals inside the vacuum.
  2. Simplified design reduces costs and usage space.
  3. The standard design is 1 million times of operation, high durability and low maintenance.
Conductive nano-supercrystals
Haosheng Technology
Conductive nano-supercrystals
Haosheng Technology
  1. Increase power quality and effective power
  2. Increase power generation capacity and reduce decay rate
  3. ESG products are non-toxic, green energy and environmentally friendly
Wafer appearance inspection equipment
TAKANO
Wafer appearance inspection equipment
TAKANO
  1. High-speed color/black and white inspection of wafer defects
  2. Optional ring lighting and transmission lighting, each lighting can be used in combination with color filters
  3. Improve detection capability & throughput
Wafer surface scanning equipment
TAKANO
Wafer surface scanning equipment
TAKANO
  1. Can detect particles or defects on the wafer surface
  2. Use violet-LD surface analyzer to effectively reduce operating costs
  3. High performance, high quality and high measurement speed, easy to operate
ALTEX Bump Height Inspection Equipment
TAKANO
ALTEX Bump Height Inspection Equipment
TAKANO
  1. High-precision measurement of bump height and coplanarity 3σ≦1.0μm is possible
  2. Inspection time for each sample is less than 2 seconds. Through unique processing algorithms and dedicated processing devices, tens of thousands of high-density bumps can be measured in a very short time.
  3. Circular bumps as small as φ30μm can be measured.
Probe measuring machine
Plum Five
Probe measuring machine
Plum Five
  1. Can inspect normal wafers, thin wafers, cut wafers or substrates with special shapes
  2. Automatically transported from the carrier via a controllable conveyor and subsequently inspected
  3. Can perform multi-zone measurements
Double-sided exposure inspection machine
Qinghe Optical
Double-sided exposure inspection machine
Qinghe Optical
  1. Widely used in exposure offset inspection, defect inspection, CoWos HBM offset inspection
  2. Top surface alignment and back surface alignment process
  3. 3D inspection technology, such as white light interferometry, confocal, AFM
Fully automatic optical inspection equipment white light interferometer
Qinghe Optical
Fully automatic optical inspection equipment white light interferometer
Qinghe Optical
  1. Measure the size of the designated position or pattern of wafer/bare wafer after integrated circuit formation and dicing.
  2. Generate a 3D model based on the information obtained when measuring height, and can also be used as a simplified SEM function.
  3. Can also perform mixed measurement of line width (2D) × height (3D)
Defect IR inspection equipment
Qinghe Optical
Defect IR inspection equipment
Qinghe Optical
  1. We have extensive experience in various inspection projects such as power devices, CMOS, crystal (tuning fork), inkjet heads, etc.
  2. We can perform non-destructive precision measurement and inspection of the positional offset of the patterns on the front and back of the wafer, and can also handle wafer surface-surface and wafer surface-interface (internal pattern) inspections
  3. Equipped with a dedicated DSI optical engine for high-precision measurement; the repeatability of the measurement can reach 3σ≦0.2～0.02μm
eFLOW
DIC
eFLOW
DIC
  1. Mask and photomask cleaning
  2. Scrubber cleaning
  3. High pressure jet cleaning
  4. Dicing process cleaning
  5. Battery cleaning
Liquid concentration meter
Zhaojing Biotechnology
Liquid concentration meter
Zhaojing Biotechnology
  1. Suitable for high temperature solutions (10-80°C) and can accurately measure multiple chemical substances simultaneously
  2. Non-contact analysis method, no risk of contamination
  3. Patented high signal-to-noise ratio sensor, can accurately measure acids, bases and organic substances
Clamp-tube liquid concentration meter
Zhaojing Biotechnology
Clamp-tube liquid concentration meter
Zhaojing Biotechnology
  1. Small size, suitable for small installation space
  2. Real-time monitoring, continuous spectrum detection
  3. Accurate analysis of high temperature liquid (10-160°C), and simultaneous measurement of multiple components
Wet process equipment
Li Jihong
Wet process equipment
Li Jihong
  1. Includes a variety of chemical acid supply systems, tank/single-wafer cleaning machines
  2. Professional secondary engineering services
Silicon Nitride Substrate
Super Energy High-Tech
Silicon Nitride Substrate
Super Energy High-Tech
  1. High strength: resistant to pressure, folding and breaking, can achieve thinner and lighter components and improve heat dissipation efficiency
  2. High thermal conductivity, good heat dissipation, good insulation performance, no leakage
  3. Suitable for ultra-fast charging, new energy vehicles and various power components
Smart Quick Screening Kit
Smart stickers
Smart Quick Screening Kit
Smart stickers
  1. Real-time monitoring and measurement of specific parameters, such as vibration, temperature, humidity, etc.
  2. With wireless transmission function, you can set warning values and notify
  3. AIoT edge computing device, built-in data compression algorithm DecayRate
Grinding and cutting solid wax
Nichika Seiko
Grinding and cutting solid wax
Nichika Seiko
  1. Temporary adhesive wax with high bonding strength, the strength requirements can be confirmed according to different processing materials and processes.
  2. Easy to operate, suitable products can be selected according to operating temperature, working viscosity, temperature resistance, etc.
  3. Easy to clean, cleaning solutions can be provided according to customer needs, and no residual pollution will be caused
Wafer laser scribing protective agent
Nichika Seiko
Wafer laser scribing protective agent
Nichika Seiko
  1. Water-soluble protective liquid can prevent the burnt materials produced by laser cutting from directly contacting or reattaching to the wafer.
  2. Suitable for fan-out packaging, CIS sensor packaging, COG/COF packaging of DDIC chips, Bumping packaging of storage chips, etc.
  3. Good protection effect, easy to clean, stable performance
Diamond Line
ASAHI Diamond
Diamond Line
ASAHI Diamond
  1. Can shorten cutting time and reduce chip damage
  2. Thin the chip
  3. After chip cutting, the thickness remains the same
Notch Wafer Groove Grinding Wheel
ASAHI Diamond
Notch Wafer Groove Grinding Wheel
ASAHI Diamond
  1. Wafer chamfering
  2. Corresponding to 2"~12" size
  3. Single groove and multi-groove types
Double Disc Straight Groove Grinding (DDSG)
ASAHI Diamond
Double Disc Straight Groove Grinding (DDSG)
ASAHI Diamond
  1. Double-sided thinning grinding wheel
  2. Use ultra-fine abrasive to increase grinding force
  3. Grinding wheels of different specifications can be customized according to customer equipment requirements
Polishing pad conditioner
ASAHI Diamond
Polishing pad conditioner
ASAHI Diamond
  1. Improve polishing performance
  2. Reduce scratches on the wafer surface
  3. Different types can be customized according to customer equipment requirements
IBSD PVD
Adnan
IBSD PVD
Adnan
  1. IBSD PVE
  2. IBSD ETCH
Equipment Automation
TDV
Equipment Automation
TDV
  1. Equipment RTM automation transformation
  2. AI image recognition
Single wafer cleaning machine
Xicheng
Single wafer cleaning machine
Xicheng
  1. Short single-chip processing time, high efficiency
  2. Strong particle removal ability, low fragmentation rate, high reliability
  3. Less sulfuric acid usage, stronger cleaning ability, effectively reducing cleaning costs
Precision V Coolant
ITW Techspray
Precision V Coolant
ITW Techspray
  1. Excellent heat transfer function and efficiency, good temperature regulation function
  2. High specific heat capacity, high dielectric strength, low dielectric constant
  3. Excellent chemical compatibility, high boiling point
Wafer transfer equipment
R2D Automation
Wafer transfer equipment
R2D Automation
  1. Helps to reduce manual work and improve production efficiency
  2. Reduce possible human errors and production risks
  3. Can meet the needs of different customers and provide customized solutions
High temperature wet oxidation furnace
Aloxtec
High temperature wet oxidation furnace
Aloxtec
  1. Specially used for VCSEL product oxidation process, with real-time monitoring function
  2. Oxidation, measurement, annealing three-in-one machine
  3. High stability and high uniformity water vapor flow control system
VCSEL Oxidation Aperture Automatic Measurement Equipment
Aloxtec
VCSEL Oxidation Aperture Automatic Measurement Equipment
Aloxtec
  1. Specially used for VCSEL aperture measurement
  2. Supports manual/automatic
  3. Can correspond to 20/50/100x CCD lens
Resin lump
DWi DOW INNOVATION
Resin lump
DWi DOW INNOVATION
  1. Used in BAND SAW and WIRE SAW processes for silicon ingot cutting to improve production quality
  2. Can be customized in different sizes according to customer requirements
  3. Can be used with adhesive products to improve production efficiency
Alkali glass
Nippon Sheet Glass
Alkali glass
Nippon Sheet Glass
  1. Mainly used in TN-LCD and STN-LCD products, main glass material for touch panels, main material for protective layer glass on touch panels
  2. Ultra-thin alkali glass
  3. Global flat glass market share is 50%
  4. Glass thickness: 0.28t~1.1t
  5. Maximum motherboard glass size: G6
tempered glass
Nippon Sheet Glass
tempered glass
Nippon Sheet Glass
  1. Glanova glass for smartphones, chemically strengthened thin glass for automotive applications
  2. High strength and strong enough
  3. Low softening point, easy to heat 3D shape
  4. Lower cost than other competing materials
Panel Level Automated Optical Inspection Machine - L
Zhongdao Optoelectronics
Panel Level Automated Optical Inspection Machine - L
Zhongdao Optoelectronics
  1. Can be applied to defect detection of various panels such as array, color film, touch screen and organic light-emitting diodes
  2. MTB is greater than 1000 hours, stable and durable
  3. Maximum detection speed can be customized
Panel Level Automated Optical Inspection Machine - H
Zhongdao Optoelectronics
Panel Level Automated Optical Inspection Machine - H
Zhongdao Optoelectronics
  1. Can be applied to defect detection of various panels such as array, color film, touch screen and organic light emitting diode
  2. The maximum measurement accuracy is 1.0 micron
  3. The maximum detection speed can be customized
Automatic line width measurement equipment
Zhongdao Optoelectronics
Automatic line width measurement equipment
Zhongdao Optoelectronics
  1. High-speed focusing microscope system with transmission and reflection modes
  2. Efficient image processing and intelligent algorithms, magnification up to 100 times
  3. Full-area measurement, no non-inspection area
Electrovert cleaning machine
ITW EAE
Electrovert cleaning machine
ITW EAE
  1. All-round spray pattern improves cleaning at close range to components and eliminates shadowing effects
  2. Hybrid spray technology
  3. Multiple integrated design features to save chemicals and electricity, reducing consumption
Centurion™ Reflow
ITW EAE
Centurion™ Reflow
ITW EAE
  1. Designed for today's high-throughput assembly environments with tight closed-loop process control
  2. Dramatically reduce thermal variation in products and use less energy
  3. Reduce maintenance requirements and lower cost of ownership through cutting-edge flux handling technology
Prodigy™ Dispensers
ITW EAE
Prodigy™ Dispensers
ITW EAE
  1. ± 35μ 3 Sigma dispensing accuracy at full speed
  2. Innovative board grading options expand the X-direction dispensing area by 1-3 times, with a maximum processing size of 900 mm
  3. Patented tilt and rotation technology reduces KOZ and improves capillary flow of underfill
Edison™ Press
ITW EAE
Edison™ Press
ITW EAE
  1. Optimized system processing speed can increase the margin of key printing parameters
  2. Wet printing accuracy improved by 25%: built-in ±8 micron alignment accuracy and ±15 micron printing repeatability (≥2 Cpk @ 6σ)
  3. No printing deviation: high-precision pressure sensor can eliminate pressure changes before and after, keeping the pressure of the entire surface constant
Mask Alignment Exposure Machine
NXQ
Mask Alignment Exposure Machine
NXQ
  1. High-precision mask alignment exposure machine, capable of processing 6, 8, 12-inch wafers and roll-to-roll substrates.
  2. Widely used in power components, LED optoelectronics, packaging, biotechnology and other industries.
Clean cloth
Texwipe
Clean cloth
Texwipe
  1. Ensure the wafer surface is clean and dust-free, which helps to ensure process stability and product quality.
  2. Anti-static ability helps to protect the safety of wafers and processes.
Adhesive
Nichika Seiko
Adhesive
Nichika Seiko
  1. Strong adhesion, high hardness, easy to peel, stable product quality
  2. Commonly known as AB glue, each set contains a main agent and a hardener, which will react chemically only after the two agents are evenly mixed
  3. Excellent heat resistance, drug resistance, and fast cutting performance
Temporary bonding liquid wax
Nichika Seiko
Temporary bonding liquid wax
Nichika Seiko
  1. Can be used for thin wafer backside processing, deep silicon etching, TSV through-hole and other processes
  2. Applicable to wafer-level packaging, compound semiconductors, MEMS and other industries
  3. High temperature resistance, chemical corrosion resistance, easy to clean, stable performance
Wafer wheel cutting cleaning agent
Nichika Seiko
Wafer wheel cutting cleaning agent
Nichika Seiko
  1. Extremely high lubricity can reduce cutting resistance and the possibility of fragmentation during wheel cutting
  2. Applicable to CIS sensor packaging, MEMS packaging, fan-out packaging and other industries
  3. Can improve cutting efficiency, good protection effect, can significantly reduce cracks, easy to clean
Grinding and thinning machine
Hidekazu
Grinding and thinning machine
Hidekazu
  1. Compatible with 4-inch, 6-inch, and 8-inch SiC thinning machines
  2. Can correspond to 150/150mm bonded wafer thinning of the same size
  3. Can provide non-contact thinning real-time monitoring
Tank type wafer cleaning machine
Shanghai Beef
Tank type wafer cleaning machine
Shanghai Beef
  1. Customizable design and production
  2. Mostly adopts integrated non-splicing design, which is not easy to produce particles and leakage, and has low maintenance costs
  3. Can be used for wafer cleaning to remove surface dust particles, etching and photoresist removal
Acid supply cabinet (CDU)
Shanghai Beef
Acid supply cabinet (CDU)
Shanghai Beef
  1. Using imported materials and integrated non-jointed design in many places, it is not easy to leak and has low maintenance cost.
  2. Can be customized
Sintered Silver Paste
Jufeng
Sintered Silver Paste
Jufeng
  1. High-power electronic component packaging material, using advanced nano silver technology
  2. Can be sintered and coated directly on copper plates without gold or silver plating
  3. Provide dispensing, steel screen printing, pressureless and pressure sintering
Copper core ball
Jufeng
Copper core ball
Jufeng
  1. Excellent BLT control, capable of constructing high reliability and ultra-fine pitch 3D packaging structures
  2. High conductivity, high heat dissipation and good electromigration resistance
  3. Provide tin alloy coated copper core balls and gold plated copper core balls
Soldering Lugs
Jufeng
Soldering Lugs
Jufeng
  1. High stability and reliability
  2. Excellent electrical and thermal conductivity
  3. High strength and good fatigue resistance
Solder Ball
Jufeng
Solder Ball
Jufeng
  1. Uniform sphericity and small diameter tolerance
  2. Excellent oxidation resistance, high solderability and high reliability
  3. Provide 0.05mm - 1.0mm and customized sizes
Intelligent Automation System
Guangyun Machinery
Intelligent Automation System
Guangyun Machinery
  1. Can shorten product development and manufacturing cycle, reduce costs
  2. Improve production efficiency and product quality
  3. Can be applied to heavy work such as industrial hazards, reduce operating errors
Edge profile optical inspection machine Edge AOI inspection
Delta
Edge profile optical inspection machine Edge AOI inspection
Delta
  1. Helps to find problems in advance and take appropriate measures to reduce defective product rates
  2. Automated detection function, which can automatically detect and analyze, reducing manual work
  3. All-in-one detection sorting machine, improves detection efficiency and consistency
Fully automatic wafer hole inspection machine
Delta
Fully automatic wafer hole inspection machine
Delta
  1. Defect detection system - resolution: 1.7um; hole inspection depth inspection
  2. AOI AI screening function to prevent dirty particles from being screened
Wafer edge grinding machine
Delta
Wafer edge grinding machine
Delta
  1. Improve wafer process efficiency and shorten production cycle
  2. Improve the stability of subsequent processes
  3. Automation function can automatically adjust parameters and perform processing, reducing the need for manual work
AOI appearance inspection and sorting machine
Delta
AOI appearance inspection and sorting machine
Delta
  1. Comprehensive inspection, AOI AI intelligent inspection algorithm, supplemented by all-round light and dark three-view optical imaging
  2. One machine with multiple functions, integrating resistance, flatness, and inspection modules
  3. Flexible production: fast size switching, automatic line change
  4. The degree of automation can be freely matched with various defect inspections according to customer requirements, and automation can be achieved at the same time
RTP rapid annealing/heat treatment furnace
Skills
RTP rapid annealing/heat treatment furnace
Skills
  1. Applicable to 8-inch and 6-inch wafer products
  2. SMIF / Open cassette loading and unloading port
  3. Compatible with atmospheric pressure / vacuum process, oxygen-free (O2 < 1 ppm) environmental monitoring
  4. Support SECS / GEM, compatible with SEMI-S2 / CE safety regulations;
Physical sputtering coating machine
Rainbow
Physical sputtering coating machine
Rainbow
  1. Highly customizable chamber configurations up to 6 chambers available
  2. Optional wafer handling architecture, ICP, degas or long throw architecture
  3. Optional in-situ pasting module for reactive sputtering
  4. Highly automated with SECS / GEM
Carbon film sputtering coater
Rainbow
Carbon film sputtering coater
Rainbow
  1. Use high vacuum physical method to coat the film
  2. The carbon film has high purity, high density and few impurities
  3. Provides good step coverage effect
  4. Special design reduces particle
Atomic layer coating machine
Rainbow
Atomic layer coating machine
Rainbow
  1. High degree of customization and automation
  2. In response to high and low temperature and charge damage concerns, thermal ALD or PEALD can be selected
  3. Patented air intake design and showerhead system design, excellent uniformity
  4. Commonly used in Al2O3, SiO2, AlN, ZrO2, SiNX, HfO2, TiN, TiO2, metal Mo and other processes
Temporary Bonding/Debonding Machine
Rainbow
Temporary Bonding/Debonding Machine
Rainbow
  1. Positioning accuracy is less than ±50um
  2. Specialized bubble-free process
  3. Can bond 150/150mm in the same size
  4. Suitable for GaAs, GaN, SiC, LED, 3DIC and other fields
Vacuum plasma equipment
Rainbow
Vacuum plasma equipment
Rainbow
  1. Applicable to photoresist or PI development, and descum can be used to remove PR or PI residues
  2. Applicable to laser release layer removal
  3. Applicable to ABF dry etching
  4. Applicable to SiC wafer grinding and plasma polish to remove damage layer
Microscopic film thickness instrument
Otsuka
Microscopic film thickness instrument
Otsuka
  1. High-precision absolute reflectivity measurement (multi-layer film thickness, optical constants) using microspectroscopy
  2. High-speed measurement in 1.1 seconds
  3. Equipped with marco function, various measurement situations can be customized
Atmospheric pressure CVD
Amaya
Atmospheric pressure CVD
Amaya
  1. New monolithic atmospheric pressure CVD for hard mask and ILD oxide insulating layer
  2. New monolithic design can cope with warped third generation semiconductor SiC wafers
Silicon carbide powder
Guanlan New Materials
Silicon carbide powder
Guanlan New Materials
  1. High-purity CVD silicon carbide crystal growth raw material
  2. Large particle size, faster, thicker and higher purity crystal growth
  3. Low crystal growth cost
X-ray Ingot Inspection Equipment
Ruisheng Optoelectronics
X-ray Ingot Inspection Equipment
Ruisheng Optoelectronics
  1. Avoids waste of resources and increased production costs
  2. Effectively ensures product quality and safety, and can detect potential problems in advance
  3. Equipped with advanced image processing and analysis software to automatically identify and classify different types of defects
Wafer box automatic packaging machine
Yifa Precision Machine
Wafer box automatic packaging machine
Yifa Precision Machine
  1. Replace manual work, maintain consistent product quality, and effectively reduce the risk of wafer breakage
  2. Automatic vacuum sealing to ensure that FOUP will not be damaged. Each important site is equipped with a monitoring system to keep records to avoid losses caused by customer complaints
  3. E84 communication, corresponding to the OHT overhead crane system, MR system automatic loading function, can be put into mass production
CMP polishing machine
Dream Semiconductor
CMP polishing machine
Dream Semiconductor
  1. Adopt PLC touch screen control system, equipment parameter setting and operation are simple and convenient, and the system operation is highly stable.
  2. Adopt cylinder pressurization method, and realize closed-loop control of pressure through electric proportional valve control to ensure extremely high pressure accuracy and stability.
  3. Polishing plate and upper pressure plate are equipped with water cooling function to ensure high efficiency of polishing liquid while reducing deformation of polishing plate surface.
TC Wafer Surface Temperature Sensor
Skills
TC Wafer Surface Temperature Sensor
Skills
  1. Can handle wafers of various sizes and substrates of different materials
  2. Temperature range: -200℃~1200℃
  3. Number of sensors can be customized according to requirements
  4. High specification accuracy: sensor to sensor ±0.5°
Kalrez perfluorocarbon seal
DuPont
Kalrez perfluorocarbon seal
DuPont
  1. Chemical resistance, excellent stability under most chemicals
  2. Heat resistance of nearly 300 degrees Celsius, still able to maintain the physical properties of rubber at high temperatures
  3. Extend the seal life and average maintenance interval, and improve the yield rate of semiconductor products
Active vibration isolation and vibration control systems for mobile platforms
GO
Active vibration isolation and vibration control systems for mobile platforms
GO
  1. Active vibration isolation in six degrees of freedom
  2. Feedforward control of mobile platform and floor
  3. No air supply required, dedicated for high-speed mobile platform
Active floor vibration isolation system
GO
Active floor vibration isolation system
GO
  1. Six degrees of freedom spatial active vibration isolation
  2. High robustness with floor vibration feed-forward function
  3. No air supply required
Polishing wastewater recycling system
Inlet
Polishing wastewater recycling system
Inlet
  1. Use patented technology to recycle and replace 70% of grinding powder/polishing powder
  2. Recycle 60% of water resources
  3. Environmentally friendly, save raw material costs
UV Cutting Tape
Good plus
UV Cutting Tape
Good plus
  1. After irradiation with ultraviolet rays of a specific wavelength, the adhesion is reduced to an extremely low level, making it easy to remove the adhesive and film from the adhered object, making it easier to process.
  2. Suitable for wafer grinding, cutting processes, and cutting and transferring of various substrates or semiconductor electronics industries
Drynon C Moisturizer
Nichika Seiko
Drynon C Moisturizer
Nichika Seiko
  1. Surfactants used after final polishing of silicon wafers and glass materials can effectively inhibit particles, HAZE and prevent metal contamination
Kilalaclean Wax Remover
Nichika Seiko
Kilalaclean Wax Remover
Nichika Seiko
  1. Suitable for high-purity cleaning of various semiconductor materials after polishing and cleaning of liquid/solid wax produced by Nichika Seiko
  2. Suitable for precision cleaning of equipment, abrasives and equipment parts that come into contact with wafers
  3. Low erosion rate, can be diluted with pure water, safer and more economical
Devel Ceramic Dish Cleaner
Nichika Seiko
Devel Ceramic Dish Cleaner
Nichika Seiko
  1. Inorganic cleaning agent, good for degreasing, suitable for wax removal and cleaning, with excellent effect
  2. No organic solvents, suitable for cleaning quartz, crystal, ceramics and other materials
  3. Safe and economical