2025-03-26
We participated in SEMICON China in 2025 and exhibited solutions covering the two major areas of "smart manufacturing" and "advanced packaging". The exhibition content spanned applications such as cutting, grinding and polishing, wafer thinning, thermal processes, thin film processes, wet processes, vacuum processes, testing, key materials, components and automation, attracting many semiconductor and packaging and testing industry professionals to stop and communicate.
In this exhibition, we emphasize module integration capabilities, provide complete solutions from materials, processes to equipment, and respond to ESG issues by exhibiting system products with high-efficiency recycling and low energy consumption. In addition, the application of intelligent monitoring and AI algorithms has also attracted widespread attention, demonstrating our innovative energy and practical ability under the wave of smart manufacturing.
This exhibition not only enhances brand visibility, but also deepens the interaction with industry customers and partners. We will continue to invest in technological innovation and contribute more value to the semiconductor industry's advanced process and yield improvement.
